Electronic Housing

Overview

The hallmarks of today’s electronic systems are their high density, complexity, and miniaturized size. To support such competitive list of features in a system, the packaging designs have to meet all technical challenges arising as a result of these requirements. In fact, high quality packaging assists the system performance by facilitating thermal management, signal distribution, serviceability, manufacturing, and power distribution.

Zekeng hardware engineering team includes 3D engineers dedicated to oversee the electronic packaging aspects of the projects. Our electronic packaging services incorporate reliability engineering and industrial design best practices to deliver the best quality packaging. Our expertise includes sheet metal and plastic enclosures, tooling, 3D printing, thermal management, and design. The successful track record of our team in electronic packaging ranges from space constrained wearable electronics design to thermally critical power electronics modules and everything in-between.

Capabilities

  • Sheet Metal and Plastic Enclosures
  • 3D Modeling
  • Metal & Plastic Casting
  • Plastic 3D Printing
  • Thermal Analysis
  • Prototyping
  • Ergonomics
  • Concept and Graphics Generation
  • Photo-realistic Images

Featured Project: Modular Guitar Effect

Challenge

High aesthetics for low cost. For creating pre-production prototype of a product that has no proven market demand, molding is unthinkable.

Solution

  • 3D printed plastic enclosure
  • Sanded, Pasted and Painted

Key Accomplishments

  • Cost Effective Premium Finish
  • Ergonomics Verification

Featured Project: Industrial Controller

Challenge

Developing a robust, cost effective casing, with screening features for industrial controller.

  • Robust
  • Cost Effective
  • Screening / Grounding
  • Thermal Durability

Solution

  • Sheet metal technology used

Key Accomplishments

  • Cost effectiveness
  • Easy to produce
  • Production Ready Design