The hallmarks of today’s electronic systems are their high density, complexity, and miniaturized size. To support such competitive list of features in a system, the packaging designs have to meet all technical challenges arising as a result of these requirements. In fact, high quality packaging assists the system performance by facilitating thermal management, signal distribution, serviceability, manufacturing, and power distribution.
Zekeng hardware engineering team includes 3D engineers dedicated to oversee the electronic packaging aspects of the projects. Our electronic packaging services incorporate reliability engineering and industrial design best practices to deliver the best quality packaging. Our expertise includes sheet metal and plastic enclosures, tooling, 3D printing, thermal management, and design. The successful track record of our team in electronic packaging ranges from space constrained wearable electronics design to thermally critical power electronics modules and everything in-between.